The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Aug. 31, 2012
Applicants:

Laura Anne Clark, Brighton, CO (US);

Tammy Jane Lucas, Highlands Ranch, CO (US);

Wyatt Keith Metzger, Louisville, CO (US);

Samuel H. Demtsu, Thornton, CO (US);

David Joseph Dickerson, Thornton, CO (US);

Laura Jean Wilson, Peyton, CO (US);

Mehran Sadeghi, Orpington, GB;

Inventors:

Laura Anne Clark, Brighton, CO (US);

Tammy Jane Lucas, Highlands Ranch, CO (US);

Wyatt Keith Metzger, Louisville, CO (US);

Samuel H. Demtsu, Thornton, CO (US);

David Joseph Dickerson, Thornton, CO (US);

Laura Jean Wilson, Peyton, CO (US);

Mehran Sadeghi, Orpington, GB;

Assignee:

First Solar, Inc., Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 31/073 (2012.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/073 (2013.01); H01L 31/1864 (2013.01); Y02E 10/543 (2013.01);
Abstract

Methods for preparing an exposed surface of a p-type absorber layer of a p-n junction for coupling to a back contact in the manufacture of a thin film photovoltaic device are provided. The method can include: applying a treatment solution onto the exposed surface defined by the p-type absorber layer of cadmium telluride; and annealing the device with the p-type absorber layer in contact with the treatment solution to form a tellurium-enriched region in the p-type absorber layer at the exposed surface. The treatment solution comprises a chlorinated compound component that is substantially free from copper, a copper-containing metal salt, and a solvent.


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