The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2015
Filed:
Feb. 27, 2014
Applicants:
Promerus, Llc, Brecksville, OH (US);
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Inventors:
Venkat Dukkipati, Copley, OH (US);
Kei Kawasaki, Tokyo, JP;
Larry Rhodes, Silver Lake, OH (US);
Toshihiro Sato, Tokyo, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 21/673 (2006.01); H01L 21/02 (2006.01); H01L 21/683 (2006.01); B29C 65/02 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/673 (2013.01); H01L 21/02 (2013.01); H01L 21/6835 (2013.01); B29C 65/02 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/11 (2015.01); Y10T 156/1153 (2015.01); Y10T 156/1195 (2015.01); Y10T 156/1994 (2015.01); Y10T 428/31663 (2015.04); Y10T 428/31924 (2015.04); Y10T 428/31931 (2015.04); Y10T 428/31938 (2015.04);
Abstract
Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.