logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9117861 B1

PDFFull Text
Date of Patent:
Aug. 25, 2015

Filed:

Feb. 27, 2014

Room temperature debonding composition, method and stack

Applicants:

Promerus, Llc, Brecksville, OH (US);

Sumitomo Bakelite Co., Ltd., Tokyo, JP;

Inventors:

Venkat Dukkipati, Copley, OH (US);

Kei Kawasaki, Tokyo, JP;

Larry Rhodes, Silver Lake, OH (US);

Toshihiro Sato, Tokyo, JP;

Assignee:

Other;

Attorney:

Balaram Gupta

Primary Examiner:

Philip Tucker

Assistant Examiner:

Nickolas Harm

Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 21/673 (2006.01); H01L 21/02 (2006.01); H01L 21/683 (2006.01); B29C 65/02 (2006.01); B32B 43/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/673 (2013.01); H01L 21/02 (2013.01); H01L 21/6835 (2013.01); B29C 65/02 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/11 (2015.01); Y10T 156/1153 (2015.01); Y10T 156/1195 (2015.01); Y10T 156/1994 (2015.01); Y10T 428/31663 (2015.04); Y10T 428/31924 (2015.04); Y10T 428/31931 (2015.04); Y10T 428/31938 (2015.04);
Abstract

Embodiments in accordance with the present invention provide for materials, methods for using such materials and structures that both incorporate such materials and are made using such methods that can be smoothly debonded at or near room temperature while providing a fixable bond that allows for wafer processing such as wafer thinning, anisotropic dry etching and chemical resistance during plating and etching.

Find Patent Forward Citations

Dukkipati, Venkat. (2015). Room temperature debonding composition, method and stack (U.S. Patent No. 9117861). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9117861

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…