The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Aug. 31, 2009
Applicant:

Danny F Ammar, Windermere, FL (US);

Inventor:

Danny F Ammar, Windermere, FL (US);

Assignee:

Stalix LLC, Orlando, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/66 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/552 (2013.01); H01L 25/16 (2013.01); H01L 2223/6627 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/19032 (2013.01); H01L 2924/19051 (2013.01); H01L 2924/3011 (2013.01); Y10T 29/49117 (2015.01);
Abstract

A highly integrated miniature RF module includes a dielectric base board with opposing top and bottom metal layers and having interconnects traces, radio frequency (RF) circuits and semiconductor chips at the top metal layer and ground and signal pads at the bottom metal layer. Metalized vias extending through the dielectric material connect the top and bottom layers. A top cover made out of laminate material, such as FR-4, with opposing top and bottom metal layers and having machined compartments and channels, surrounded with arrays of metal plated vias extending through the laminate material, protects the RF circuits and chips and provide the required isolation and wave propagation.


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