The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Jun. 28, 2013
Applicant:

Materion Corporation, Mayfield Heights, OH (US);

Inventors:

George Michael Wityak, Albuquerque, NM (US);

Richard Koba, Saugus, MA (US);

Assignee:

Materion Corporation, Mayfield Heights, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/043 (2006.01); H01L 23/373 (2006.01); H01L 23/34 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3732 (2013.01); H01L 23/34 (2013.01); H01L 23/3733 (2013.01); H01L 23/3736 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/49586 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A high thermal conductivity base plate is provided for use in air cavity packages. The base plate is at least partially comprised of a composite made of silver-diamond or a silver alloy-diamond. In some embodiments, the base plate is entirely comprised of the composite. In other embodiments, the base plate has a core made of the composite. The core can include at least one outer layer on the core. The semiconductor package can include one or more dice or transistors on the base plate, an insulated frame on the base plate, and one or more leads on the insulated frame.


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