The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Jan. 30, 2014
Applicants:

Anirban Roy, Austin, TX (US);

Craig A. Cavins, Pflugerville, TX (US);

Inventors:

Anirban Roy, Austin, TX (US);

Craig A. Cavins, Pflugerville, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2006.01); H01L 21/28 (2006.01); H01L 29/49 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 27/112 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28273 (2013.01); H01L 27/112 (2013.01); H01L 27/115 (2013.01); H01L 27/11517 (2013.01); H01L 27/11548 (2013.01); H01L 27/11563 (2013.01); H01L 27/11568 (2013.01); H01L 29/42324 (2013.01); H01L 29/42336 (2013.01); H01L 29/4916 (2013.01); H01L 29/66825 (2013.01);
Abstract

Methods are disclosed for extending floating gate regions within floating gate cells to form sub-lithographic features. Related floating gate cells and non-volatile memory (NVM) systems are also disclosed. In part, the disclosed embodiments utilize a spacer etch to form extended floating gate regions and floating gate slits with sub-lithographic dimensions thereby achieving desired increased spacing between control gate layers and doped regions underlying floating gate structures while still allowing for reductions in the overall size of floating-gate NVM cells. These advantageous results are achieved in part by depositing an additional floating gate layer over previously formed floating gate regions and then using the spacer etch to form the extended floating gate regions as sidewall structures and sub-lithographic floating gate slits. The resulting floating gate structures reduce breakdown down risks, thereby improving device reliability.


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