The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

May. 07, 2014
Applicant:

Covalent Materials Corporation, Tokyo, JP;

Inventors:

Jun Komiyama, Hadano, JP;

Akira Yoshida, Tokyo, JP;

Hiroshi Oishi, Hadano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/12 (2006.01); H01L 29/20 (2006.01); H01L 21/3205 (2006.01); H01L 29/10 (2006.01); H01L 21/02 (2006.01); H01L 29/778 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02458 (2013.01); H01L 21/02507 (2013.01); H01L 21/02576 (2013.01); H01L 21/02579 (2013.01); H01L 29/1075 (2013.01); H01L 29/7786 (2013.01);
Abstract

A nitride semiconductor substrate suitable for a high withstand voltage power device is provided in which current collapse is controlled, while reducing leakage current. In a nitride semiconductor substrate, wherein a buffer layer, an active layer, and an electron supply layer, each comprising a group 13 nitride, are stacked one by one on a silicon single crystal substrate, the buffer layer has a structure where a multilayer stack in which a pair of nitride layers having different concentrations of Al or Ga are repeatedly deposited a plurality of times on an initial layer of AlGaN (0≦x≦1) is stacked, and includes a doping layer whose carbon concentration is 1×10to 1×10cmand whose Si concentration is 1×10to 1×10cm, a thickness of the doping layer is 15% or more of the total thickness of the buffer layer.


Find Patent Forward Citations

Loading…