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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9116199 B1

PDFFull Text
Date of Patent:
Aug. 25, 2015

Filed:

Mar. 02, 2012

Full-bridge magnetoresistive rotation sensors and mass fabrication method

Applicants:

James G. Deak, Zhangjiagang, CN;

Weifeng Shen, Zhangjiagang, CN;

Xiaojun Zhang, Zhangjiagang, CN;

Xiaofeng Lei, Zhangjiagang, CN;

Insik Jin, Zhangjiagang, CN;

Songsheng Xue, Zhangjiagang, CN;

Inventors:

James G. Deak, Zhangjiagang, CN;

Weifeng Shen, Zhangjiagang, CN;

Xiaojun Zhang, Zhangjiagang, CN;

Xiaofeng Lei, Zhangjiagang, CN;

Insik Jin, Zhangjiagang, CN;

Songsheng Xue, Zhangjiagang, CN;

Assignee:

MultiDimension Technology Co., Ltd., , CN;

Attorney:

Schwegman Lundberg & Woessner, P.A.

Primary Examiner:

Jermele M Hollington

Assistant Examiner:

Raul Rios Russo

Int. Cl.
CPC ...
G01B 7/14 (2006.01); G01B 7/30 (2006.01); G01R 33/06 (2006.01); H01L 43/08 (2006.01); G01R 33/09 (2006.01); B82Y 25/00 (2011.01); G01D 5/14 (2006.01); G01R 33/02 (2006.01);
U.S. Cl.
CPC ...
G01R 33/098 (2013.01); B82Y 25/00 (2013.01); G01B 7/30 (2013.01); G01D 5/145 (2013.01); G01R 33/093 (2013.01); H01L 43/08 (2013.01);
Abstract

A single package magnetoresistive angle sensor for use in measuring rotation angle of a magnet is disclosed. The magnetoresistive angle sensor comprises a pair of magnetoresistive sensor chips, wherein one of the chips is rotated by 180-degree rotation relative to the other. The magnetoresistive sensor chips are attached to a standard semiconductor package lead frame to form a single-axis push-pull full-bridge sensor. Each of the magnetoresistive sensor chips comprises a pair of magnetoresistance sensor arms. Each magnetoresistive sensor arm comprises one or more GMR or MTJ sensor elements. The GMR of MTR sensor elements utilize a pined layer. The element blocks of the magnetoresistive sensor electrically are interconnected and connected to the package leads by wirebonding. The magnetoresistive angle sensor can be packaged into various standard semiconductor package designs. Also, provided is a dual-axis push-pull full-bridge magnetoresistive angle sensor comprised of two pairs of magnetoresistive sensor chips.

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