The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Sep. 18, 2014
Applicant:

Smoltek Ab, Gothenburg, SE;

Inventors:

Jonas T. Berg, Hyssna, SE;

Vincent Desmaris, Göteborg, SE;

Mohammad Shafiqul Kabir, Göteborg, SE;

Muhammad Amin Saleem, Göteborg, SE;

David Brud, Henån, SE;

Assignee:

Smoltek AB, Göteborg, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); C01B 31/02 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H01L 21/768 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 23/498 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C01B 31/0206 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); H01L 21/02491 (2013.01); H01L 21/02603 (2013.01); H01L 21/02639 (2013.01); H01L 21/02645 (2013.01); H01L 21/76876 (2013.01); H01L 21/76877 (2013.01); H01L 21/76879 (2013.01); H01L 23/49827 (2013.01); H01L 29/0665 (2013.01); H01L 29/66439 (2013.01); H01L 21/0237 (2013.01); H01L 21/0262 (2013.01); H01L 21/02521 (2013.01); H01L 21/02606 (2013.01); H01L 2221/1094 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method for making one or more nanostructures is disclosed, the method comprising: depositing a conducting layer on an upper surface of a substrate; depositing a patterned layer of catalyst on the conducting layer; growing the one or more nanostructures on the layer of catalyst; and selectively removing the conducting layer between and around the one or more nanostructures. A device is also disclosed, comprising a substrate, wherein the substrate comprises one or more exposed metal islands separated by one or more insulating areas; a conducting helplayer disposed on the substrate covering at least some of the one or more exposed metal islands or insulating areas; a catalyst layer disposed on the conducting helplayer; and one or more nanostructures disposed on the catalyst layer.


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