The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2015

Filed:

Jun. 17, 2010
Applicants:

Alessandro Gomez, Orange, CT (US);

Weiwei Deng, Orlando, FL (US);

Inventors:

Alessandro Gomez, Orange, CT (US);

Weiwei Deng, Orlando, FL (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A01G 23/10 (2006.01); B05B 1/24 (2006.01); B05B 1/14 (2006.01); B05B 5/00 (2006.01); B05B 5/053 (2006.01); B05B 5/03 (2006.01);
U.S. Cl.
CPC ...
B05B 5/0533 (2013.01); B05B 5/03 (2013.01);
Abstract

The present invention is directed to a multiplexed system for electrospraying cooling fluid to produce electrically charged droplets essentially uniform in size for cooling applications. The system comprise a preferably microfabricated fluid distributor consisting of multiple nozzles/atomizers from which the droplets are dispersed, an extractor electrode consisting in an electrically conductive plate with multiple holes coaxial with the nozzles and a third electrode consisting of either the surface to be cooled or another conductive material in contact with said surface. The system provides highly efficient cooling by avoiding the droplet rebound, when the charged droplets are pinned on the surface to be cooled by the electric image force. Testing of a prototype system demonstrated a heat flux removal of 96 W/cmwith a remarkable cooling efficiency reaching 97%. Applications of the invention pertain to the effective removal of high heat flux from microelectronic chips or similar devices with cooling requirements.


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