The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Feb. 04, 2014
Applicant:

Samsung Electronics Co., Ltd, Suwon-si, Gyeonggi-do, KR;

Inventors:

Yo-Se Eum, Cheonan-si, KR;

Sang-Geun Kim, Cheonan-si, KR;

Seok-Yong Lee, Cheonan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/683 (2006.01); H05K 3/34 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3478 (2013.01); B23K 1/0016 (2013.01); B23K 3/0623 (2013.01); B23K 3/08 (2013.01); H01L 21/4853 (2013.01); H01L 21/6838 (2013.01); H01L 24/11 (2013.01); B23K 2201/42 (2013.01); H01L 2924/0002 (2013.01); H05K 2203/041 (2013.01); Y10T 29/41 (2015.01);
Abstract

A method of forming external terminals of a package is provided in which a package substrate may be fixed, an edge portion of the package substrate may be supported to prevent the edge portion of the package substrate from being upwardly bent, a mask having openings may be arranged on the package substrate, and the external terminals may be supplied to the package substrate through the openings of the mask. The supporting portion may downwardly press the edge portion of the package substrate so that the edge portion of the package substrate may not be upwardly bent. As a result, the external terminals on the package substrate may have a uniform thickness.


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