The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Jan. 30, 2012
Applicants:
Hangfeng Ji, Hangzhou, CN;
Abraham Rudolf Balkenende, Heeze, NL;
Hong Chen, Shanghai, CN;
Inventors:
Assignee:
KONINKLIJKE PHILIPS N.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 3/30 (2006.01); H05K 3/22 (2006.01); H05K 1/02 (2006.01); H05K 3/32 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); H05K 3/22 (2013.01); H05K 1/0269 (2013.01); H05K 3/321 (2013.01); H05K 3/34 (2013.01); H05K 2201/09936 (2013.01); H05K 2203/047 (2013.01); H05K 2203/176 (2013.01); H05K 2203/178 (2013.01); Y10T 156/1089 (2015.01);
Abstract
The present invention relates to a printed circuit board assembly (), said printed circuit board assembly comprising: a substrate (); two or more electronic components which are categorized, wherein each component is secured to the substrate by securing means having a different predetermined thermal-release temperature, depending on which category said component belongs to. The invention furthermore relates to a method of assembling the printed circuit board assembly and a method of disassembling the printed circuit board assembly according to the invention.