The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Sep. 05, 2012
Sang-uk Han, Gyeonggi-do, KR;
Young-shin Kwon, Gyeonggi-do, KR;
Kwan-jai Lee, Gyeonggi-do, KR;
Jae-min Jung, Seoul, KR;
Kyong-soon Cho, Gyeonggi-do, KR;
Jeong-kyu Ha, Gyeonggi-do, KR;
Sang-uk Han, Gyeonggi-do, KR;
Young-shin Kwon, Gyeonggi-do, KR;
Kwan-jai Lee, Gyeonggi-do, KR;
Jae-min Jung, Seoul, KR;
Kyong-soon Cho, Gyeonggi-do, KR;
Jeong-kyu Ha, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A tape wiring substrate includes a base film having at least one recess in a first surface of the base film and a chip-mounting region on which a semiconductor chip is included on a second surface of the base film. A wiring pattern is formed on the second surface of the base film and is extended to an edge of the chip-mounting region. A protection film covers the wiring pattern.