The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Nov. 24, 2014
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Akihito Miyamoto, Osaka, JP;

Yuko Okumoto, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/40 (2006.01); H01L 51/05 (2006.01); H01L 29/786 (2006.01); H01L 51/50 (2006.01); H01L 51/00 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0545 (2013.01); H01L 29/786 (2013.01); H01L 27/3246 (2013.01); H01L 51/0036 (2013.01); H01L 51/5088 (2013.01);
Abstract

An electronic device including: a substrate; a bank formed on an upper surface of the substrate, surrounding an area of the upper surface of the substrate, and defining an aperture from which the area is exposed; a liquid-philic layer formed on a peripheral portion of the area, and not overlapping a central portion of the area; a semiconductor layer formed within the aperture, and attaching to at least a portion of the central portion and to an upper surface of the liquid-philic layer; and a pair of electrodes that are in contact with an area of the semiconductor layer, the area of the semiconductor layer not overlapping the liquid-philic layer in plan view. The bank has a liquid-phobic lateral surface surrounding the aperture, and the upper surface of the liquid-philic layer has a higher degree of liquid-philicity than the upper surface of the substrate.


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