The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Jul. 08, 2014
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventors:

Tetsuya Yagi, Anan, JP;

Yuki Miyaura, Komatsushima, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/52 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 25/075 (2006.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 27/15 (2013.01); H01L 33/483 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 33/60 (2013.01);
Abstract

With a light emitting device of a package formed by two types of molded resins, entry of water from between the molded resins may cause the light emitting device to be incapable of turning on. A light emitting device of the present invention includes: a package that has an opening at an upper surface thereof; a first molded resin that forms a part of the upper surface of the package; a second molded resin that forms an inner wall surface of the opening of the package; a lead frame that is buried in the package so as to be partially exposed at a bottom surface of the opening of the package, the lead frame having an end portion externally projected outside from a side surface of the package; and a light emitting element that is connected to an upper surface of the lead frame being exposed at the bottom surface of the opening. The second molded resin is higher than the first molded resin in light reflectance to light emitted from the light emitting element. The upper surface of the lead frame buried in the package is disposed so as to be spaced apart from the interface between the first molded resin and the second molded resin.


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