The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9111974 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 18, 2015

Filed:

Nov. 23, 2010
Applicants:

Shunpei Yamazaki, Setagaya, JP;

Noriyuki Matsuda, Atsugi, JP;

Inventors:

Shunpei Yamazaki, Setagaya, JP;

Noriyuki Matsuda, Atsugi, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 73/00 (2006.01); G06Q 30/00 (2012.01); H01L 21/673 (2006.01); G06Q 10/08 (2012.01); H01L 21/67 (2006.01); B65D 25/14 (2006.01); B65D 85/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67396 (2013.01); G06Q 10/083 (2013.01); G06Q 10/0837 (2013.01); H01L 21/67276 (2013.01);
Abstract

The present invention provides a manufacturing method by which a substrate (typically, a TFT substrate) can be installed directly in a treatment apparatus by using a transfer container without transferring the substrate. It is possible to use the container efficiently and transfer different substrates in size with one container. A manufacturing method in which a substrate is directly installed in an electrostatic-protected transfer container by a substrate supplier, and then the container is directly installed a treatment apparatus by a substrate demander after transferring can be realized, thereby making it possible to transfer substrates such as a TFT substrate. A contamination of a substrate due to particles and electrostatic discharge damage of a TFT substrate can be avoided because a transferring operation is not needed. A manufacturing method in which a substrate holding portion of the container is replaced depending on the size of a substrate and different substrates in size can be transferred with one container may be employed.


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