The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Aug. 20, 2013
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventor:

Sadatoshi Murakami, Kanagawa-ken, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/792 (2006.01); H01L 29/66 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66833 (2013.01); H01L 27/1157 (2013.01); H01L 27/11582 (2013.01); H01L 29/7926 (2013.01);
Abstract

According to one embodiment, a method for manufacturing a semiconductor memory device includes forming a plurality of pillars and a plurality of sidewall films on a stacked body including a plurality of electrode layers stacked alternately with a plurality of insulating layers. The pillars are arranged in a first direction and a second direction intersecting the first direction at different pitches in the first direction and the second direction. The sidewall films are provided on outer circumferential surfaces of the pillars to extend in the first direction to be linked in the first direction and separated in the second direction. The method includes making a slit to divide the stacked body in the second direction by etching the stacked body under a region between the sidewall films adjacent to each other in the second direction using the pillars and the sidewall films as a mask.


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