The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Mar. 15, 2013
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Chihiro Migita, Tokyo, JP;

Hiroshi Kikuchi, Hidaka, JP;

Yoshiaki Takemoto, Tokyo, JP;

Yoshitaka Tadaki, Hanno, JP;

Assignee:

OLYMPUS CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/498 (2006.01); H01L 21/28 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/28 (2013.01); H01L 21/4853 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A wiring substrate may include: a base having a predetermined thickness; a plurality of electrode portions formed to protrude on one surface in a thickness direction of the base; a wiring provided in the base and electrically connected to the electrode portions; and a resin layer formed on the base to fill between the plurality of electrode portions. An upper surface of the resin layer may be formed in a concave shape lower than a maximum height of the electrode portion, and an upper surface of the electrode portion and the upper surface of the resin layer form a continuous curved surface.


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