The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Nov. 01, 2012
Low cost and high performance bonding of wafer to interposer and method of forming vias and circuits
Triton Microtechnologies, Oro Valley, AZ (US);
Tim Mobley, Marana, AZ (US);
TRITON MICROTECHNOLOGIES, Oro Valley, AZ (US);
Abstract
A low cost and high performance method for bonding a wafer to an interposer is provided. The technology provides designs and metallization techniques for through via glass applications that is thermal coefficient expansion matched to the glass or synthetic fused quartz substrates. An off-the-shelf glass, such as borosilicate based or Fused Synthetic Quartz, is used with a thick film Cu or Ag and/or a Sodium Ion Enriched (SIE) coating or glass, which may be applied or fired onto the substrate or wafer. Polymer based coatings can be applied in a sequential build-up process for purposes of redistribution of signals from a silicon integrated circuit to the opposite side of the substrate or wafer. Additionally, metallizations can be applied on top of the polymers and patterned to create a multilayer circuit.