The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Sep. 13, 2012
Gerald K. Bartley, Rochester, MN (US);
Charles L. Johnson, Rochester, MN (US);
John E. Kelly, Iii, Poughquag, NY (US);
Joseph Kuczynski, Rochester, MN (US);
David R. Motschman, Rochester, MN (US);
Arvind K. Sinha, Rochester, MN (US);
Kevin A. Splittstoesser, Stewartville, MN (US);
Timothy J. Tofil, Rochester, MN (US);
Gerald K. Bartley, Rochester, MN (US);
Charles L. Johnson, Rochester, MN (US);
John E. Kelly, III, Poughquag, NY (US);
Joseph Kuczynski, Rochester, MN (US);
David R. Motschman, Rochester, MN (US);
Arvind K. Sinha, Rochester, MN (US);
Kevin A. Splittstoesser, Stewartville, MN (US);
Timothy J. Tofil, Rochester, MN (US);
Lenovo, Singapore, SG;
Abstract
The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad placed between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip and nanofibers aligned perpendicular to mating surfaces of the first chip and the second chip.