The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Oct. 03, 2012
Canon Kabushiki Kaisha, Tokyo, JP;
Yoshitomo Fujisawa, Kawasaki, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
The printed circuit board () includes the interposer () where the semiconductor element () is mounted and the electrode pad () is formed on one surface, the printed wiring board () where the electrode pad () is formed on one surface facing the interposer (), and the joint material () for bonding the electrode pads () and (). The joint material () includes the solder layer () formed by the solder material () and the metal layers (), () provided to the electrode pads () and (). Each metal layer () includes the metal particle aggregate () in which metal particles are integrated with voids and is formed by filling the voids in the metal particle aggregate () with melted solder material (). It is possible to ensure the height of the solder, improve reliability of the bonding, and downsize the semiconductor device by using such joint material.