The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Sep. 17, 2014
Applicant:

International Rectifier Corporation, El Segundo, CA (US);

Inventor:

Eung San Cho, Torrance, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 25/11 (2006.01); H01L 25/16 (2006.01); H01L 23/492 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 21/4853 (2013.01); H01L 21/4871 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/492 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/24 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 24/82 (2013.01); H01L 24/92 (2013.01); H01L 25/117 (2013.01); H01L 25/16 (2013.01); H01L 23/49568 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24245 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73259 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/8382 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/92224 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/1032 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1815 (2013.01);
Abstract

In one implementation, a power semiconductor package includes a non-contiguous, multi-section conductive carrier. A control transistor with a control transistor terminal is coupled to a first section of the multi-section conductive carrier, while a sync transistor with a sync transistor terminal is coupled to a second section of the multi-section conductive carrier. The first and second sections of the multi-section conductive carrier sink heat generated by the control and sync transistors. The first and second sections of the multi-section conductive carrier are electrically connected only through a mounting surface attached to the power semiconductor package. Another implementation of the power semiconductor package includes a driver IC coupled to a third section of the multi-section conductive carrier. A method for fabricating the power semiconductor package is also disclosed. The power semiconductor package according to the present disclosure results in effective thermal protection, current carrying capability, and a relatively small size.


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