The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9111759 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 18, 2015

Filed:

Oct. 11, 2013
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventor:

Kazuya Yamaguchi, Matumoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/36 (2006.01); H01L 29/04 (2006.01); H01L 23/544 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/045 (2013.01); H01L 23/544 (2013.01); H01L 21/0245 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02494 (2013.01); H01L 21/02532 (2013.01); H01L 21/02587 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device manufacturing method with high productivity is disclosed with improved trade-off relationship between auto-doping and breakdown in alignment mark form. First to sixth epitaxial layers are grown sequentially on Si {100} main surface of an arsenic doped substrate using multilayer epitaxial technology. Epitaxial growth conditions of the first to sixth epitaxial layers are growth at atmospheric pressure and a temperature of 1,150° C. to 1,180° C., with epitaxial growth rate of 2.2 to 2.6 μm/minute. An alignment mark of depressed form whose bottom surface is the Si {100} plane is formed in the arsenic doped substrate. Every time one of the first to sixth epitaxial layers is grown on the main surface of the arsenic doped substrate, an alignment mark of depressed form is formed in the outermost epitaxial layer by a portion above the alignment mark of the layer below being transformed.


Find Patent Forward Citations

Yamaguchi, Kazuya. (2015). Semiconductor device manufacturing method (U.S. Patent No. 9111759). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9111759

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