The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Aug. 19, 2009
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Toshiyuki Iwanaga, Sabae, JP;
Akihiro Yoshida, Echizen, JP;
Takayuki Kayatani, Echizen, JP;
Akihiro Motoki, Fukui, JP;
Makoto Ogawa, Fukui, JP;
Toshiyuki Iwanaga, Sabae, JP;
Akihiro Yoshida, Echizen, JP;
Takayuki Kayatani, Echizen, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 μm by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.