The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Dec. 19, 2013
Applicants:

Gary L. Miller, Austin, TX (US);

Derek J. Beattie, Giffnock, GB;

Inventors:

Gary L. Miller, Austin, TX (US);

Derek J. Beattie, Giffnock, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/82 (2006.01); G11C 11/34 (2006.01); G11C 7/00 (2006.01); G11C 29/00 (2006.01); G11C 14/00 (2006.01);
U.S. Cl.
CPC ...
G11C 29/789 (2013.01); G11C 14/00 (2013.01);
Abstract

A system in a package (SiP) includes a first semiconductor die having a nonvolatile memory and trim/repair circuitry, and a second semiconductor die having a volatile memory and trim/repair circuitry. The first and the second semiconductor die are in a same package. The nonvolatile memory of the first semiconductor die is configured to store trim/repair values for each of the first and the second semiconductor die. The trim/repair circuitries of the first and second semiconductor die are configured to, in response to a reset of the second semiconductor die, copy the trim/repair values from the nonvolatile memory of the first semiconductor die to the volatile memory of the second semiconductor die.


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