The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Sep. 01, 2011
Applicants:

Joo-woan Cho, Asan-si, KR;

Yong-woo Lee, Suwon-si, KR;

Hyoung-joo Kim, Anyang-si, KR;

Inventors:

Joo-Woan Cho, Asan-si, KR;

Yong-Woo Lee, Suwon-si, KR;

Hyoung-Joo Kim, Anyang-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); F21V 7/04 (2006.01); G09F 13/22 (2006.01);
U.S. Cl.
CPC ...
G09F 13/22 (2013.01); G02F 1/133608 (2013.01); G02F 1/133603 (2013.01); G02F 2001/133612 (2013.01);
Abstract

A backlight assembly includes a light-emitting diode (LED) module and a bottom chassis. The LED module includes an LED package in which at least one LED chip is mounted, and first and second wire sockets respectively making contact with lead frames formed at two sides of the LED package. The bottom chassis has a coupling hole formed through a bottom portion for receiving a coupling hook of the LED module. Thus, a wire socket is configured to make contact with a lead frame formed at a side portion of an LED package and power is received through a wire inserted through the wire socket, so that an additional printed circuit board (PCB) or an additional flexible printed circuit board (FPCB) for providing the LED package with power may be omitted.


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