The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

May. 04, 2011
Applicants:

Jian-huei Feng, San Jose, CA (US);

Ming Jiang, San Jose, CA (US);

Clayton R. Newman, Pleasanton, CA (US);

Yeak-chong Wong, San Jose, CA (US);

Inventors:

Jian-Huei Feng, San Jose, CA (US);

Ming Jiang, San Jose, CA (US);

Clayton R. Newman, Pleasanton, CA (US);

Yeak-Chong Wong, San Jose, CA (US);

Assignee:

Western Digital (Fremont), LLC, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); G05B 2219/45031 (2013.01);
Abstract

Methods for providing asymmetric control of process parameters are described. One such method includes receiving a data point for the process parameter relative to the wafer, selecting a first value for a process weighting factor when the data point is consistent with a first criteria, selecting a second value for the process weighting factor when the data point is consistent with a second criteria, where the second value is not equal to the first value, calculating an exponential weighted moving average of the process parameter based on the data point and the process weighting factor, updating the process parameter with the exponential weighted moving average, and using the updated process parameter to control the process and thereby treat the wafer. The methods can use one or more weighting factor switch limits to define different areas of risk associated with a target for the process parameter.


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