The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9110128 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 18, 2015

Filed:

Oct. 03, 2008
Applicant:

Jon M. Long, Livermore, CA (US);

Inventor:

Jon M. Long, Livermore, CA (US);

Assignee:

Altera Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 7/10 (2006.01); H05K 7/12 (2006.01); G01R 31/20 (2006.01); H01R 13/24 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/28 (2013.01);
Abstract

An integrated circuit (IC) package with a plurality of contact leads and a plurality of contact pads disposed on a surface of the IC package is disclosed. The contact pads may be used as test probes for testing the IC. Having a plurality of contact pads may create more test locations on the IC package. The size of the IC package may also be reduced by using contact pads instead of contact leads for testing. A socket body for the IC package is also disclosed. The socket body has a plurality of contactors extending outward from the socket body. The contactors may have different heights to contact each of the contact pads and contact leads on the IC package. The contactors may be adjustable to different heights. In some embodiments, a portion of the contactors may be compressed when and IC package is placed in the socket body.


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