The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Jun. 04, 2014
Sekisui Chemical Co., Ltd., Osaka, JP;
Yasuhiro Kawaguchi, Yamaguchi, JP;
Yoshiyuki Kosaka, Osaka, JP;
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Abstract
A thermally expandable microcapsule, which shows excellent heat resistance and a high expansion ratio and thereby can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding. The thermally expandable microcapsule also provides a foamed product using the thermally expandable microcapsule. The thermally expandable microcapsule contains a shell made of a polymer; and a volatile expansion agent as a core agent encapsulated in the shell, the storage elastic modulus (E') of the shell at a temperature of 200° C. and a frequency of 10 Hz being 1×10N/mor more, the storage elastic modulus (E′) of the shell at a temperature of 250° C. and a frequency of 10 Hz being 1×10N/mor more, and a maximum displacement amount measured by thermomechanical analysis being 300 μm or more.