The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Jul. 10, 2012
Applicants:

David Anthony Wagner, Northville, MI (US);

Michael M. Azzouz, Livonia, MI (US);

Ari Garo Caliskan, Canton, MI (US);

Xiaoming Chen, Canton, MI (US);

John Edward Huber, Novi, MI (US);

Yuksel Gur, Ann Arbor, MI (US);

Sunil K. Kasaragod, Canton, MI (US);

Parameswararao Pothuraju, Canton, MI (US);

Jeffery Wallace, Walled Lake, MI (US);

Inventors:

David Anthony Wagner, Northville, MI (US);

Michael M. Azzouz, Livonia, MI (US);

Ari Garo Caliskan, Canton, MI (US);

Xiaoming Chen, Canton, MI (US);

John Edward Huber, Novi, MI (US);

Yuksel Gur, Ann Arbor, MI (US);

Sunil K. Kasaragod, Canton, MI (US);

Parameswararao Pothuraju, Canton, MI (US);

Jeffery Wallace, Walled Lake, MI (US);

Assignee:

FORD GLOBAL TECHNOLOGIES, LLC, Dearborn, MI (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B62D 21/00 (2006.01); B62D 21/02 (2006.01); B23K 26/28 (2014.01); B23K 31/02 (2006.01); B23K 33/00 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
B62D 21/02 (2013.01); B23K 26/28 (2013.01); B23K 31/02 (2013.01); B23K 33/006 (2013.01); B23K 33/008 (2013.01); B32B 37/1284 (2013.01); B23K 2201/006 (2013.01); B23K 2201/185 (2013.01); B23K 2201/28 (2013.01); B23K 2203/08 (2013.01); B23K 2203/18 (2013.01); B23K 2203/20 (2013.01); Y10T 29/49622 (2015.01); Y10T 29/49826 (2015.01); Y10T 29/49956 (2015.01); Y10T 156/1002 (2015.01); Y10T 156/1051 (2015.01);
Abstract

The present disclosure relates to various vehicle frame assemblies and methods of manufacturing the same. The vehicle frame assemblies have rails composed of dissimilar materials.


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