The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Mar. 08, 2011
Rie Sugie, Tokyo, JP;
Toshihiro Hoshi, Tokyo, JP;
Tadahiro Mita, Tokyo, JP;
Kunihiro Fukue, Tokyo, JP;
Atsushi Koda, Tokyo, JP;
Kazuya Ayabe, Tokyo, JP;
Rie Sugie, Tokyo, JP;
Toshihiro Hoshi, Tokyo, JP;
Tadahiro Mita, Tokyo, JP;
Kunihiro Fukue, Tokyo, JP;
Atsushi Koda, Tokyo, JP;
Kazuya Ayabe, Tokyo, JP;
AKEBONO BRAKE INDUSTRY CO., LTD., Tokyo, JP;
Abstract
Disclosed are a compression molding apparatus and a molding die, whereby efficient hot-molding is performed. The compression molding apparatus performs a molding by providing a raw material into the molding die, and applying heat and pressure to the material. The apparatus is provided with: a first molding die, which forms a molding frame that surrounds a region where the raw material is compression-molded; a second molding die, which compresses the raw material provided into the molding frame; and a heat source section, which supports and heats the second molding die. The second molding die has: a first heat pipe, which has one end positioned on the heat source section side, and the other end positioned on the side of a pressing surface that presses the raw material; and a heat insulating layer, which wraps the first heat pipe along the longitudinal direction of the first heat pipe.