The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Aug. 18, 2008
Applicants:

Arne Schmidt, Darmstadt, DE;

Christian Eberle, Griesheim, DE;

Marc Poth, Reinheim, DE;

Klaus Albrecht, Mainz, DE;

Erwin Buerkle, Benediktbeuern, DE;

Martin Eichlseder, Tettenweis, DE;

Inventors:

Arne Schmidt, Darmstadt, DE;

Christian Eberle, Griesheim, DE;

Marc Poth, Reinheim, DE;

Klaus Albrecht, Mainz, DE;

Erwin Buerkle, Benediktbeuern, DE;

Martin Eichlseder, Tettenweis, DE;

Assignees:

Evonik Röhm GmbH, Darmstadt, DE;

Krauss Maffei Technologies GmbH, München, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 37/00 (2006.01); B29C 45/16 (2006.01); B29C 45/73 (2006.01); B29K 33/00 (2006.01); B29K 79/00 (2006.01); B29C 67/24 (2006.01);
U.S. Cl.
CPC ...
B29C 37/0028 (2013.01); B29C 45/1679 (2013.01); B29C 45/73 (2013.01); B29C 67/246 (2013.01); B29C 2045/735 (2013.01); B29C 2045/7343 (2013.01); B29C 2045/7368 (2013.01); B29K 2033/12 (2013.01); B29K 2079/08 (2013.01);
Abstract

The present invention relates to a process for the production of coated mouldings, by injecting a moulding composition into an injection mould and cooling the composition to obtain a moulding, and altering the injection mould in such a way as to produce an intermediate space between a surface to be coated of the moulding and the inner surface of the injection mould, and using injection moulding to charge a reactive mixture to the resultant intermediate space, where the temperature of at least a portion of the injection mould is increased for the curing of the reactive mixture. The present invention moreover describes a system for the conduct of the process described above.


Find Patent Forward Citations

Loading…