The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Sep. 22, 2011
Applicant:

Hamed Lakrout, Midland, MI (US);

Inventor:

Hamed Lakrout, Midland, MI (US);

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D 11/00 (2006.01); B24B 37/22 (2012.01); B24B 37/26 (2012.01); B24D 18/00 (2006.01);
U.S. Cl.
CPC ...
B24B 37/22 (2013.01); B24B 37/26 (2013.01); B24D 18/00 (2013.01);
Abstract

The invention is a method of forming a layered-open-network polishing pad useful for polishing at least one of magnetic, semiconductor and optical substrates. Exposing a first and second polymer sheet or film of a photocurable polymer creates an exposure pattern in the first and second polymer sheet. The exposure pattern has elongated sections exposed to the energy source. The light exposure is of an exposure time sufficient to cure the photocurable polymer, but insufficient to cure adjacent elongated sections together. Attaching the first and second polymer sheets forms a polishing pad with the patterns of the first and second polymer sheets crossing. Curing the layered-open-network polishing pad to secure the layered-open-network polishing pad with the first and second sheets having sufficient stiffness to reduce sagging and maintain an orthogonal relationship between the elongated channels and the parallel planes of the polymer sheets.


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