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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9108275 B1

PDFFull Text
Date of Patent:
Aug. 18, 2015

Filed:

Oct. 10, 2013

Bi-material strip and a method of bonding strips of different materials together

Applicant:

Federal-mogul Corporation, Southfield, MI (US);

Inventor:

David Michael Saxton, Ann Arbor, MI (US);

Assignee:

Federal-Mogul Corporation, Southfield, MI (US);

Attorneys:

Robert L. Stearns

Dickinson Wright, PLLC

Primary Examiner:

Erin Saad

Int. Cl.
CPC ...
B23K 31/00 (2006.01); B23K 35/24 (2006.01); B23K 37/00 (2006.01); B22F 7/04 (2006.01); B23K 20/227 (2006.01); B32B 15/01 (2006.01); F16C 33/14 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); B21B 1/38 (2006.01); B23K 20/04 (2006.01); B22F 3/18 (2006.01); C22C 21/00 (2006.01); C22C 38/00 (2006.01); B23K 35/30 (2006.01); B23K 35/02 (2006.01); F16C 33/12 (2006.01); C22C 1/04 (2006.01);
U.S. Cl.
CPC ...
B23K 35/24 (2013.01); B21B 1/38 (2013.01); B22F 3/18 (2013.01); B22F 7/04 (2013.01); B23K 1/0008 (2013.01); B23K 1/19 (2013.01); B23K 20/04 (2013.01); B23K 20/2275 (2013.01); B23K 35/0244 (2013.01); B23K 35/302 (2013.01); B23K 37/003 (2013.01); B32B 15/012 (2013.01); B32B 15/013 (2013.01); B32B 15/015 (2013.01); C22C 21/00 (2013.01); C22C 38/00 (2013.01); F16C 33/14 (2013.01); B22F 2003/185 (2013.01); B22F 2999/00 (2013.01); B23K 2201/185 (2013.01); B23K 2203/20 (2013.01); C22C 1/0425 (2013.01); F16C 33/122 (2013.01); Y10T 428/12069 (2015.01);
Abstract

A continuous hot bonding method for producing a bi-material strip with a strong bond therebetween is provided. The method comprises sanding a first strip formed of steel; and applying a layer of first particles, typically formed of copper, to the sanded first strip. The method next includes heating the first strip and the layer of the first particles, followed by pressing a second strip formed of an aluminum alloy onto the heated layer of the first particles. The aluminum alloy of the second strip includes tin particles, and the heat causes the second particles to liquefy and dissolve into the melted first particles. The first particles and the second particles bond together to form bond enhancing metal particles, which typically comprise bronze.

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