The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2015
Filed:
Aug. 25, 2014
Topline Corporation, Irvine, CA (US);
Martin B. Hart, Irvine, CA (US);
Roger C. Young, Yorba Linda, CA (US);
TOPLINE CORPORATION, Irvine, CA (US);
Abstract
A disposable apparatus with a plurality of preloaded pins such as solder columns, micro-coil springs, or other cylindrically shaped metallic parts (solder columns, et al.) in an array pattern is provided for aligning and dispensing onto a column grid array (CGA) substrate. The apparatus is comprised of a carrier plate with a pattern of holes that is covered by a layer of sacrificial adhesive tape with sufficient tackiness to retain, position and hold an array of solder columns, et al. Alignment features on the bottom of the carrier plate plugs into a jig alignment fixture that precisely positions the solder columns, et al. over a CGA substrate. After peeling away the sacrificial adhesive tape from the apparatus, the payload of solder columns, et al. detaches and transfers by gravity onto a pattern of metal pads on the CGA substrate, without the use of vacuum or vibration.