The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
Sep. 15, 2010
Applicants:
Taishi Morikawa, Makinohara, JP;
Hidenori Kanda, Makinohara, JP;
Inventors:
Taishi Morikawa, Makinohara, JP;
Hidenori Kanda, Makinohara, JP;
Assignee:
Yazaki Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 3/30 (2006.01); H01R 43/24 (2006.01); B29C 45/14 (2006.01); H01R 4/18 (2006.01); H01R 101/00 (2006.01);
U.S. Cl.
CPC ...
H01R 43/24 (2013.01); B29C 45/14 (2013.01); B29C 45/14418 (2013.01); B29C 45/14639 (2013.01); H01R 4/184 (2013.01); H01R 2101/00 (2013.01);
Abstract
A resin material can be prevented from flowing to a front end and a rear end of an inner terminal during an insert molding. Under a state that a hollow and tubular main body part () of an inner terminal () formed by covering one of two end parts of a rectangular piece with the other is held by metal molds (), () and (), the resin material is injected.