The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
Jan. 24, 2012
Applicants:
Takeshi Okuyama, Tokyo, JP;
Toshihiro Kusagaya, Tokyo, JP;
Tohru Yamakami, Tokyo, JP;
Inventors:
Assignee:
FUJITSU COMPONENT LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01R 12/57 (2011.01); H01R 4/02 (2006.01); H05K 3/34 (2006.01); H01R 12/72 (2011.01); H01R 13/6587 (2011.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01R 12/57 (2013.01); H01R 4/028 (2013.01); H05K 3/3426 (2013.01); H01R 12/724 (2013.01); H01R 13/6587 (2013.01); H05K 1/025 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10757 (2013.01); H05K 2201/10803 (2013.01); H05K 2201/10909 (2013.01); H05K 2201/2081 (2013.01);
Abstract
Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.