The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Jun. 30, 2008
Applicants:

Marcus Antonius Verschuuren, Eindhoven, NL;

Herbert Lifka, Eindhoven, NL;

Cristina Tanase, Eindhoven, NL;

Inventors:

Marcus Antonius Verschuuren, Eindhoven, NL;

Herbert Lifka, Eindhoven, NL;

Cristina Tanase, Eindhoven, NL;

Assignee:

KONINKLIJKE PHILIPS N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 27/30 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5212 (2013.01); H01L 51/5206 (2013.01); H01L 51/56 (2013.01); H01L 27/301 (2013.01); H01L 51/0021 (2013.01); H01L 2251/105 (2013.01);
Abstract

This invention relates to a method for forming a patterned layer on a substrate by means of an imprint process. According to the method a first layer is provided on the substrate, and a pattern of recesses is provided in the first layer by imprinting the layer with a patterning means. Then the first layer is cured. The curing is followed by performing a first surface treatment onto the first layer to make the surface of thereof hydrophilic, and then performing a second surface treatment onto a selected subarea of the surface of the first layer to make the. subarea hydrophobic. The subarea includes surface portions between the recesses and excludes the recesses. Finally, a conducting pattern material () is deposited into the recesses.


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