logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9105822 B1

PDFFull Text
Expired
Date of Patent:
Aug. 11, 2015

Filed:

Dec. 09, 2013

Material for a molded resin for use in a semiconductor light-emitting device

Applicant:

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Inventors:

Mayuko Takasu, Kitakyushu, JP;

Takeshi Otsu, Yokohama, JP;

Kenichi Takizawa, Kitakyushu, JP;

Yutaka Mori, Kitakyushu, JP;

Assignee:

MITSUBISHI CHEMICAL CORPORATION, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Bijan Ahvazi

Int. Cl.
CPC ...
F21V 9/00 (2006.01); G02B 5/02 (2006.01); G02C 7/10 (2006.01); G02F 1/361 (2006.01); G03B 11/00 (2006.01); H01L 33/56 (2010.01); B29B 7/00 (2006.01); B29C 45/00 (2006.01); C08L 83/00 (2006.01); C08L 83/04 (2006.01); C08K 3/36 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08K 5/56 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); C08L 83/04 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08K 3/36 (2013.01); C08K 5/56 (2013.01); C08K 2003/2227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49107 (2013.01); H01L 2933/0091 (2013.01);
Abstract

The present invention provides a material for a molded resin as a material for a semiconductor light-emitting device that can yield a highly durable (light resistance and heat resistance) molded resin and can also improve the LED output through an excellent reflectivity. The present invention also provides an easily moldable material for a molded resin for a semiconductor light-emitting device. The material for a molded resin for a semiconductor light-emitting device is a resin composition, comprising (A) a polyorganosiloxane, (B) a white pigment, and (C) a curing catalyst, wherein the white pigment (B) has the following characteristics (a) and (b):

Find Patent Forward Citations

Takasu, Mayuko. (2015). Material for a molded resin for use in a semiconductor light-emitting device (U.S. Patent No. 9105822). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9105822

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…