The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Aug. 12, 2011
Applicants:

Karl Weidner, München, DE;

Hans Wulkesch, München, DE;

Axel Kaltenbacher, Mintraching, DE;

Walter Wegleiter, Nittendorf, DE;

Johann Ramchen, Altdorf, DE;

Inventors:

Karl Weidner, München, DE;

Hans Wulkesch, München, DE;

Axel Kaltenbacher, Mintraching, DE;

Walter Wegleiter, Nittendorf, DE;

Johann Ramchen, Altdorf, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/0232 (2014.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 31/0232 (2013.01); H01L 24/24 (2013.01); H01L 33/0095 (2013.01); H01L 33/48 (2013.01); H01L 33/62 (2013.01); H01L 21/76804 (2013.01); H01L 33/486 (2013.01); H01L 2224/18 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.


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