The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Jan. 29, 2014
Applicant:

Stmicroelectronics (Crolles 2) Sas, Crolles, FR;

Inventor:

Vincent Farys, Saint Martin d' 'Heres, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 21/033 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76895 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01); H01L 21/32139 (2013.01); H01L 21/76838 (2013.01); H01L 23/528 (2013.01);
Abstract

The invention concerns a method comprising: forming a plurality of parallel lines () of a sacrificial material over a layer of conductive material () of an integrated circuit, said parallel lines being separated by trenches, at least one of said lines being interrupted along its length by an opening () dividing it into first and second line portions (A,B) separated by a space (S); forming spacers () in said trenches on lateral sides of said line portions and filling at least a bottom part of said opening between the line portions; removing the sacrificial material by etching; and forming interconnection lines (A,B,A,B,) of said conductive material based on a pattern defined by said spacers.


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