The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
Aug. 07, 2012
Applicants:
Satoru Wakiyama, Kanagawa, JP;
Hiroshi Ozaki, Kanagawa, JP;
Inventors:
Satoru Wakiyama, Kanagawa, JP;
Hiroshi Ozaki, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 27/14618 (2013.01); H01L 21/563 (2013.01); H01L 27/14683 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/11416 (2013.01); H01L 2224/11436 (2013.01); H01L 2224/11825 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13076 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13562 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16503 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/73104 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/8181 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81355 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81413 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81951 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/94 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15321 (2013.01);
Abstract
A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump.