The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Jan. 28, 2014
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Mitsuhiro Noguchi, Kanagawa, JP;

Masayuki Akou, Kanagawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 29/423 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4941 (2013.01); H01L 27/11541 (2013.01); H01L 29/42376 (2013.01);
Abstract

A semiconductor device according to an embodiment includes a gate wire including a laminated film in which a polysilicon film, a barrier conductive film, and a metal film are laminated in this order; a first contact plug/upper layer wire arranged above the source or the drain; a second upper layer wire arranged above an element isolation region; a second contact plug arranged apart from the second upper layer wire and connecting the metal film and the polysilicon film above a channel region; and a third contact plug formed apart from the polysilicon film in the element isolation region and connecting the second upper layer wire and the metal film. The second contact plug includes a barrier metal in contact with the polysilicon film and the barrier conductive film is made of WN, TaN, or Ta and the barrier metal is made of Ti or TiN.


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