The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Jun. 29, 2012
Applicants:

Cristiano Gianluca Stella, San Gregorio di Catania, IT;

Concetto Privitera, Gravina di Catania, IT;

Inventors:

Cristiano Gianluca Stella, San Gregorio di Catania, IT;

Concetto Privitera, Gravina di Catania, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza (MB), IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3672 (2013.01); H01L 23/40 (2013.01); H01L 23/36 (2013.01); H01L 23/3677 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/4913 (2015.01);
Abstract

An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin.


Find Patent Forward Citations

Loading…