The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
Oct. 07, 2013
Applicants:
Yonghoon Kim, Suwon-si, KR;
Hyo-soon Kang, Seoul, KR;
Inho Choi, Seoul, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01);
Abstract
A package-on-package device includes memory chips side-by-side on a package substrate. Accordingly, it is possible to reduce a thickness of a semiconductor package. Further, data and command pads of a logic chip may be located to be adjacent to data and command pads of the memory chips. Accordingly, a routing distance between pads can be contracted and thus signal delivery speed can be improved. This makes it possible to improve an operation speed of the device.