The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
Dec. 26, 2013
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/58 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/00 (2013.01); H01L 23/585 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/19 (2013.01); H01L 25/0657 (2013.01); H01L 23/3128 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14134 (2013.01); H01L 2224/14136 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16148 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/1713 (2013.01); H01L 2224/17136 (2013.01); H01L 2224/17517 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor device includes an extended semiconductor chip including a first semiconductor chip and an extension outwardly extending from a side surface of the first semiconductor chip; and a second semiconductor chip connected to the extended semiconductor chip through a plurality of bumps and electrically connected to the first semiconductor chip. The first semiconductor chip is smaller than the second semiconductor chip. At least one external terminal is provided on the extension.