The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Sep. 11, 2013
Applicant:

Tdk Corporation, Minato-ku, Tokyo, JP;

Inventors:

Sunao Masuda, Tokyo, JP;

Katsumi Kobayashi, Tokyo, JP;

Takashi Komatsu, Nikaho, JP;

Akitoshi Yoshii, Tokyo, JP;

Kazuyuki Hasebe, Nikaho, JP;

Kayou Kusano, Nikaho, JP;

Norihisa Ando, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/228 (2006.01); H01G 2/06 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 2/06 (2013.01); H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01); H01G 4/12 (2013.01);
Abstract

A ceramic electronic component with metal terminals comprising a chip component formed with terminal electrodes at both ends, and a pair of metal terminals comprising a flat plate portion having a flat plate portion facing face provided so that it faces an end face of said chip component and connected to said terminal electrodes via a joining portion , and a mounting portion connected to one end portion of said flat plate portion and extending approximately perpendicular to said flat plate portion, wherein said mounting portion has a mounting portion bottom face forming an angle of approximately 270 degrees with respect to said flat plate portion, and a mounting portion upper face forming an angle of approximately 90 degrees with respect to said flat plate portion, and a solder adhering prevention area having lower wettability than said mounting portion bottom face is formed.


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