The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
May. 09, 2007
Applicants:
Gerhard Lohninger, Munich, DE;
Johann P. Forstner, Steinhoering, DE;
Rudolf Lachner, Ingolstadt, DE;
Inventors:
Gerhard Lohninger, Munich, DE;
Johann P. Forstner, Steinhoering, DE;
Rudolf Lachner, Ingolstadt, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/40 (2006.01); H01Q 9/28 (2006.01); G01S 7/03 (2006.01); H01Q 23/00 (2006.01);
U.S. Cl.
CPC ...
G01S 7/03 (2013.01); H01Q 1/38 (2013.01); H01Q 9/285 (2013.01); H01Q 23/00 (2013.01);
Abstract
Electronic apparatus having an antenna chip with a substrate and an antenna structure, and a method of producing the same. The antenna chip is integrated or packaged in a package having a clip mounting surface for mounting the antenna chip, and an encapsulating material. The encapsulating material typically is a plastic mold used in the industrial packaging of integrated circuits. Between the antenna structure and the chip mounting surface, a first void is disposed in the substrate.