The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Sep. 15, 2011
Applicants:

Jiannrong Lee, Webster, NY (US);

Yuhao Sun, Fremont, CA (US);

Maung Kyaw Aung, Union City, CA (US);

Chin-jen Tseng, Fremont, CA (US);

Chiapu Chang, Saratoga, CA (US);

Shuji Rokutanda, Fremont, CA (US);

Rong-chang Liang, Cupertino, CA (US);

Inventors:

Jiannrong Lee, Webster, NY (US);

Yuhao Sun, Fremont, CA (US);

Maung Kyaw Aung, Union City, CA (US);

Chin-Jen Tseng, Fremont, CA (US);

Chiapu Chang, Saratoga, CA (US);

Shuji Rokutanda, Fremont, CA (US);

Rong-Chang Liang, Cupertino, CA (US);

Assignee:

Trillion Science, Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01); B32B 3/10 (2006.01); B65G 17/36 (2006.01); B32B 38/10 (2006.01); B32B 37/14 (2006.01); C09J 9/02 (2006.01); B32B 37/22 (2006.01); C09J 7/00 (2006.01); B32B 7/12 (2006.01); B32B 27/14 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 37/12 (2006.01); B32B 38/06 (2006.01); C08K 9/02 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); B32B 3/10 (2013.01); B32B 5/16 (2013.01); B32B 7/12 (2013.01); B32B 27/14 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 37/14 (2013.01); B32B 37/226 (2013.01); B32B 38/10 (2013.01); B65G 17/36 (2013.01); C09J 7/00 (2013.01); B32B 37/12 (2013.01); B32B 38/06 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/105 (2013.01); B32B 2266/045 (2013.01); B32B 2307/202 (2013.01); B32B 2309/08 (2013.01); B32B 2310/0843 (2013.01); B32B 2457/00 (2013.01); C08K 9/02 (2013.01); C08K 2201/001 (2013.01); C09J 2201/28 (2013.01); C09J 2201/602 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2433/00 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); H05K 3/321 (2013.01); Y10T 156/1066 (2015.01); Y10T 428/24893 (2015.01); Y10T 428/249921 (2015.04);
Abstract

A method for fabricating an electronic device or component such as an anisotropic conductive film comprising: distributing a plurality of conductive particles into an array of microcavities formed on a surface of a continuous carrier belt, rotating the belt carrying the conductive particles while conveying a surface of an adhesive layer into contact with the surface of the rotating belt, transferring the conductive particles from the microcavities on the belt to the adhesive layer in predefined locations in the adhesive layer corresponding to the array of microcavities on the belt, and separating the adhesive layer from the surface of the belt. In one embodiment, the position of the microcavities is varied in a controlled manner.


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