The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Sep. 22, 2008
Applicants:

Takashi Sato, Hiratsuka, JP;

Shuichi Ueno, Hiratsuka, JP;

Takeshi Koyama, Hiratsuka, JP;

Inventors:

Takashi Sato, Hiratsuka, JP;

Shuichi Ueno, Hiratsuka, JP;

Takeshi Koyama, Hiratsuka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08L 63/00 (2006.01); C08K 5/13 (2006.01); C08G 59/24 (2006.01); H01L 51/52 (2006.01); C08G 59/22 (2006.01); C08G 59/42 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
C08G 59/24 (2013.01); C08G 59/226 (2013.01); C08G 59/42 (2013.01); C08L 63/00 (2013.01); H01L 51/5237 (2013.01); H01L 33/56 (2013.01);
Abstract

Provided are an epoxy resin composition including acid anhydrides (A) and epoxy resins (B), in which: (a) cyclohexane-1,2,4-tricarboxylic acid-1,2-anhydride accounts for 50 to 90 mass % of the acid anhydrides (A); (b) an alicyclic epoxy resin compound accounts for 30 to 90 mass % of the epoxy resins (B) and an epoxy resin compound represented by the following general formula (1) accounts for 10 to 50 mass % of the epoxy resins (B); and (c) contents of the acid anhydrides (A) and the epoxy resins (B) are such that a blending equivalent ratio between the acid anhydrides and the epoxy resins ranges from 0.4 to 0.7, a cured product of the composition, and a light-emitting diode. The epoxy resin composition has the following characteristics. That is, (1) the composition has a low viscosity after the mixing, a low degree of viscosity increase in standing at room temperature, and excellent workability, (2) the composition has satisfactory curability even when no curing accelerator is added, and (3) a cured product is colorless and transparent, has crack resistance, and changes its color to a small extent with long-term light irradiation and heating. The composition is suitable for an encapsulant for a photoelectric conversion element such as a blue LED or white LED. (In the formula, R's each independently represent a hydrogen atom or a methyl group, m represents an integer of 1 to 3, and n represents an integer of 2 to 8.)


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