The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2015
Filed:
Sep. 12, 2011
Applicants:
Takehiko Sumi, Ebina, JP;
Tadatoshi Tanji, Fujisawa, JP;
Kenji Iwasaki, Nagoya, JP;
Inventors:
Assignee:
KYORAKU CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 51/02 (2006.01); B29C 51/00 (2006.01); B29C 51/30 (2006.01); B29C 47/36 (2006.01); B29C 65/78 (2006.01); B29C 47/00 (2006.01); B29K 503/04 (2006.01); B29K 96/04 (2006.01); B29L 31/30 (2006.01); B29L 23/00 (2006.01); B29C 47/04 (2006.01); B29C 47/08 (2006.01); B29C 47/16 (2006.01); B29K 23/00 (2006.01); B29C 47/34 (2006.01); B29C 47/54 (2006.01); B29C 49/00 (2006.01); B29K 105/04 (2006.01); B29C 51/10 (2006.01); B29C 51/26 (2006.01); B29C 49/04 (2006.01); B29C 49/42 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
B29C 51/00 (2013.01); B29C 47/366 (2013.01); B29C 51/303 (2013.01); B29C 47/0004 (2013.01); B29C 47/005 (2013.01); B29C 47/0019 (2013.01); B29C 47/0021 (2013.01); B29C 47/0052 (2013.01); B29C 47/0054 (2013.01); B29C 47/04 (2013.01); B29C 47/084 (2013.01); B29C 47/165 (2013.01); B29C 47/34 (2013.01); B29C 47/54 (2013.01); B29C 49/0005 (2013.01); B29C 49/041 (2013.01); B29C 51/02 (2013.01); B29C 51/10 (2013.01); B29C 51/261 (2013.01); B29C 51/267 (2013.01); B29C 65/78 (2013.01); B29C 65/7841 (2013.01); B29C 65/7847 (2013.01); B29C 2049/047 (2013.01); B29C 2049/4294 (2013.01); B29C 2791/001 (2013.01); B29C 2791/006 (2013.01); B29C 2947/926 (2013.01); B29C 2947/9259 (2013.01); B29C 2947/92647 (2013.01); B29C 2947/92857 (2013.01); B29C 2947/92904 (2013.01); B29C 2947/92923 (2013.01); B29C 2947/92933 (2013.01); B29K 2023/06 (2013.01); B29K 2023/12 (2013.01); B29K 2096/04 (2013.01); B29K 2101/12 (2013.01); B29K 2105/04 (2013.01); B29K 2223/06 (2013.01); B29K 2223/12 (2013.01); B29K 2503/04 (2013.01); B29L 2023/003 (2013.01); B29L 2023/004 (2013.01); B29L 2023/22 (2013.01); B29L 2031/3032 (2013.01);
Abstract
The present invention provides a molding apparatus by which it is possible to make a frame located around a mold contact thermoplastic resin. In the molding apparatus of the present invention, the thermoplastic resin extruded from an extruding machine in a sheet form is adsorbed onto a cavity surface of the mold. As a result, the thermoplastic resin is shaped into a shape according to the cavity surface. The molding apparatus includes a frame that is positioned around the mold and is movable relative to the mold. In the frame, a suction part to suck the thermoplastic resin is provided.